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The MPP range of manual wire bonders includes manual and semi-automatic systems for gold ball, wedge and ribbon bonding. The equipment is used forSperryTek offers a diversity of training and educational programs conducted by our bonder staff of dedicated professionals which can be provided on-site. Large 5.3” x 5.3” (134 mm x. 134 mm) bonding area. ? One bond head for deep access & standard bonding. ? Consistent tail length with real-time fine adjust K&S 4500 Digital Series Manual Wire Bonders Operations and Maintenance high-voltage cable or remove the N.E.F.O. box, unplug the machine . 4-15. 4.3.10 4524AD Screens (S. Point Tab Mode) Cross Hair Generator Kit for 115 Volt. Advanced Packaging (TCB) · Advanced Packaging (Hybrid) · Ball Bonder · Die Attach · Electronics Assembly · Lithography · Wafer Level Bonder · Wedge Bonder.