爱达荷州立大学中国学生学者联谊会

Chinese Association of Idaho State University (CAISU)

Introducing Pak to Boost Intelligence of Smart Packaging Machines

Introducing Pak to Boost Intelligence of Smart Packaging Machines

Responding to end user needs to rapidly adjust to changing consumer demands and OEM requirements to incorporate the latest technologies into their machines, Mitsubishi Electric Automation, Inc., introduces Pak/iQ™ to solve the challenges of both customer segments in the packaging industry. Pak/iQ is a comprehensive portfolio of packaging products designed to improve the performance and lower the total cost of deploying smart packaging machines.liquid vacuum packing machine

The foundation of Pak/iQ is Mitsubishi Electric’s iQ platform – a modular programmable automation controller that combines several automation disciplines into a single, simplified architecture. Designed to provide superior OEM productivity and machine performance, Mitsubishi Electric’s portfolio of products and value-add solutions include pre-configured diagnostic and maintenance screens, pre-configured operator screens and a pre-engineered application code library for faster designs. Pak/iQ is ideal for bottling, pillowing and wrapping machines to reduce unscheduled downtime and increase production.

Single software environment: user-friendly experience with fully integrated PLC and motion configuration, programming and diagnostics
By offering a single solution to end users and OEMs in the packaging industry, we not only provide the latest technology and best-in-breed products, we offer the convenience of a single-source supplier, resulting in better inter-connectivity in the system configuration,” said Elaine Wang, product marketing engineer for servo and motion control, Mitsubishi Electric Automation, Inc. “For example, the vibration suppression capabilities of our servo amplifiers allow for faster production due to reduction in unintentional movement in the mechanical components of the machine.”

“Pak/iQ will be particularly welcomed by our OEM customers who want to improve packaging machine innovation for their end user customers,” said Lee Cheung, product marketing engineer for controller and visualization, Mitsubishi Electric Automation, Inc. “OEMs will be able to reduce machine development time because of the seamless inter-connectivity of machine components and the ability to reuse existing engineering program code for variations of similar processes.”

查看次数: 3

评论

您必须是爱达荷州立大学中国学生学者联谊会 的成员才能加评论!

加入 爱达荷州立大学中国学生学者联谊会

Local News

© 2020   Created by Webmaster.   提供支持

徽章  |  报告问题  |  用户协议